SBIR/STTR Research Award

Satellite Optical Backplane

Award identifier 6909f8d621672303f9dc7ccf48fce5a4e4f9d0f4a085ffba4f9f697f994381e3Awarding agency Department of Defense · Air Force

Award amount

$99,995

Program and phase

SBIR · Phase I

Award year

2011

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Award details

Awarding agency
Department of Defense
Branch
Air Force
Recipient company
EM PHOTONICS INC
Proposal award date
2011-02-25
Contract end date
Not reported
UEI
CA3NJCKCTN63
Solicitation number
2010.3
Topic code
AF103-097

Research abstract

ABSTRACT: Optical interconnects are the natural choice for interconnecting different chips when current interconnect technologies cannot fulfill current and future system requirements. Examples of optical interconnect architectures are free-space multistage interconnect, optical fiber interconnect, and thin film polymer waveguide-based optical interconnect. While all these architectures were successfully capable of satisfying the requirements for an optically interconnected system, the size they occupy is considerably large to be integrated on a chip-level optical system, especially with the minimum feature size of chip shrinking one year after the other. Nano-scale optical interconnects are now needed to satisfy future interconnect needs, since they will not only meet system requirements but will also occupy a size comparable to the interconnected chips. Typical Avionics Networks Requirements include; Many Different I/O Types,- RF, Analog, Digital, Discrete & Timing Strobes,- EMI Problems in Mixed Signal Environment, Many Different Network Media / Connectors Coaxial, TSP, Copper Cable, F/O, Backplane Traces/Vias, Many High Bandwidth/High Frequency Channels Avionics Modules are Connector Bound, Still Desire 2-Level Line-Replaceable Modules, Sensors Located Throughout Airframe, Coaxial Cable Has High Signal Losses/Distortion, Many Pt-to-Pt Cables Reduce Manufacturing Repeatability, Decrease Reliability/Effective Diagnostics. What is needed is a common network that can satisfy all connectivity requirements of an avionics suite, single channel, and single connector. Chip-Scale optical switching fabric can provide this universal avionics network if specific component, cost & packaging challenges can be overcome! BENEFIT: We intend to market a product based on the final device as part of the STTR program. We anticipate our initial market to be government and military applications but we will secondarily bring the final product to the commercial market. There are many groups that will benefit from this technology including the DoD, satellite TV and radio broadcasters, and private space companies. This platform will be useful in military applications ranging from communications to missile guidance to long-range imaging. Additionally, we believe that this device will convince more people to utilize the proposed chip-scale switch fabric in their designs, as this novel platform will greatly improve performance and open the door for many new applications.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Awards with the same topic code

Verified by an exact topic code match. This is not a text-similarity match.

Research funding history

83 SBIR/STTR records share this UEI (2001–2024). Reported award amounts total $31,278,630. Reported amounts are not federal obligations.

Phases: Phase I, Phase II

Agencies: Department of Defense, National Aeronautics and Space Administration, Department of Energy, Department of Education, Department of Health and Human Services, National Science Foundation

Agency intelligence

Department of Defense

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