KW Fiber Pump Combiner with Polarization Maintaining Feed Through

High power laser systems are limited in their ability to scale up laser power, increase compactness, maintain stability, and lengthen product lifetime due to the need to manage heat-loading. In particular, current laser diode packaging technology severely constrains improvements its size, weight, performance and robustness of laser systems. Eotron has developed a novel laser diode packaging technology using a silicon material and MEMS process to deliver three times better laser diode cooling efficiency when compared against copper micro-channel laser diode technology. Eotron's technology increases the wall plug efficiency of the laser system significantly and also reduces the diode bar"smile"problem associated with high power laser diode systems. Using a precision registration and stress-free mounting technology for laser diode packaging, the fiber coupling efficiency of laser diode stack is improved. The improvement of fiber coupling efficiency can reduce the laser system's size and weight and increase the overall compactness. BENEFIT: The introduction of high fiber-coupling efficiency of the new silicon laser diode packaging technology will bring a disruptive change in the photonics industry's manufacturing processes. The new silicon laser diode packaging will bring high quality and high performance to fiber coupled laser diode products using the well-established semiconductor manufacturing process to lower the cost of high power laser systems in the welding, cutting, soldering, brazing, hardening, and military markets.