SBIR/STTR Research Award

SBIR Phase I: Heat Pipe for Ground Source Heat Pump

Award identifier e338261f33da380c7f5709edbb1cca9b9906830334b66c5d748f8c64de601aa8Awarding agency National Science Foundation

Award amount

$150,000

Program and phase

SBIR · Phase I

Award year

2011

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Award details

Awarding agency
National Science Foundation
Branch
Not reported
Recipient company
Forthright Engineering LLC
Proposal award date
2011-01-01
Contract end date
2011-12-31
UEI
Not reported
Solicitation number
Not reported
Topic code
BC

Research abstract

This Small Business Innovation Research (SBIR) Phase I project will develop an earth heat exchanger that has a lower installation cost, lower operating cost, and smaller footprint than the currently available ground source heat pumps. High ground loop installation costs are the primary barrier to broader acceptance of ground source heat pump technology despite its efficiency advantage. By replacing the circulating liquid pipes with a "heat-pipe" arrangement which consists of a closed pipe containing a saturated working fluid which is cyclically evaporated and condensed at different locations within the heat-pipe, heat transfer efficiency between the earth and the heat pump refrigerant is increased. A heat-pipe heat exchanger would require no electricity in heating mode and only a very small amount of electricity in cooling mode. A novel working fluid which has a low vapor pressure, is non-toxic, inexpensive, and is not a potential ground water contaminant has been identified. Successful completion of this project will result in a heat-pipe exchanger that is more economical to install and operate. The broader/commercial impacts of this research are increased adoption of ground source heat pumps, the most efficient means of heating and cooling. The heat-pipe will have a lower internal thermal resistance and will use a larger pipe diameter than CLPS which will increase the contact surface area per unit length. This will allow less boring/trenching, will simplify installation, and will lower installation costs. A significant reduction in the cost and footprint of installations could increase adoption in both new building and retrofit applications. World demand for HVAC equipment will rise more than five percent per year through 2012, exceeding $70 billion. The US market is growing at 3.2% per year and exceeded $14B in 2009. The new technology will be licensed to heat pump manufacturers.

Technology keywords

Not reported

Agency intelligence

National Science Foundation

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