Microscale Ordnance Technologies for Micro Air Vehicles (MAVs)

Our recent developmental efforts have successfully produced the design for a chip slapper with a reduction in the average size (miniaturization), weight and cost of these particular chip slappers. The processes that we have established in the production of this chip slapper have reduced the number of assembly stages for this particular assembly configuration and/or application. Production of this style chip slapper has also been modified with the reduction of manufacturing stages and more stringent quality controls during the manufacturing, providing a more robust cost effective and smaller component. We propose to reduce the standard size chip slapper by approx. 84% with acceptable industry standard practices. The following is a review of standard industry manufacturing techniques for the production of the chip slappers. We have included our proposal for a smaller chip relative to the process design we have come up with. We believe that we have also increased yield and not compromised the quality of these components but have in fact improved the performance. There are several unique practices which we feel have improved our production, miniaturization, and cost reduction all of the following technical details are proprietary. BENEFIT: Improved guidance and navigation has given us the ability to deliver precision effects, and has allowed us to reduce our ordnance payloads and, thereby, reduce collateral effects. This trend toward ever smaller munitions is being driven by our need to conduct military operations in urban terrain and to severely control collateral effects. The goal in this effort is to further miniaturize ordnance components (damage mechanisms, energetic, fusing) for delivery by micro air vehicles. Damage mechanisms other than blast/fragmentation may be proposed.