High-Speed Method to Produce Flexible Pressure Sensors

The promise of printed electronics can not be realized without high-speed manufacturing processes to drive the cost down for wide spread distribution. This proposal will outline the key points for rapid manufacturing of new electronic devices and systems and make recommendations for making them a reality. There are two main focus areas that encompass all the limitations to printed integrated circuits: (1) the materials issues of developing the optimal active semiconductor and conductive circuit connections and (2) the fabrication methods and material / substrate interactions that achieve the desired performance, print speed and provide robustness of the final product. ANI will utilize its high-quality nanoparticle based inks for high-speed production of an active electronic device. The concept entails using a state-of-the-art nanoparticle inks for electrical contact lines, soluble organic semiconductors and printable dielectrics all applied using high-speed ink-jet technologies.