SBIR/STTR Research Award
Lead-free Solder Alternative Interconnect Material
Award amount
$99,490Program and phase
SBIR · Phase IAward year
2010Award details
- Awarding agency
- Department of Defense
- Branch
- Air Force
- Recipient company
- TPF Enterprises LLC
- Proposal award date
- 2010-01-07
- Contract end date
- 2010-10-08
- UEI
- Not reported
- Solicitation number
- 2009.3
- Topic code
- AF093-111
Research abstract
Nano silver-coated copper pastes will be prepared and evaluated as an economic alternative to tin-lead or tin-silver copper paste for improved processability, properties and reliability combined with compatibitibility with legacy components and solder systems. BENEFIT: Compared with current lead-free solder systems these nano silver coated copper pastes will provide a lower processing temperature equivalent to tin-lead solder, acceptable economics, compliant and lightweight joints and compatibility with legacy and anticipated components and boards. The joints do not contain low-melting alloys subject to creep constraints at equipment operating temperatures, contain abundant metals and will be field processable with existing production and rework equipment.
Technology keywords
Not reported
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- Lead-free Solder Alternative Interconnect Material
- Lead-free Solder Alternative Interconnect Material