Prognostic Integrated Multi-Sensor MEMS Module (PRISM)

Impact Technologies, in cooperation with the MicroElectronics Department at the Rochester Institute of Technology, proposes to create a single-chip MEMS multi-sensor device capable of collecting comprehensive prognostic data. By integrating many of the sensing elements required for effective prognostic life estimation within a single tiny device, the invasiveness and expense associated with implementing condition-based maintenance practices can be dramatically reduced. The proposed MEMS-based module will record temperature, humidity, vibration/shock and stress/strain data for processing via prognostic algorithms. Key tasks of this Phase I effort include: - Design and Integration of multiple MEMS sensing elements operating in close proximity aboard a single silicon chip. - Development of signal conditioning circuitry tailored for driving and recording data from the prognostic MEMS sensing system. - Optimizing power usage based on data sampling rate and duration required for each specific application. - Creating an overall package design that encompasses the sensor, electronics, and communications in form factor that can be noninvasively deployed aboard most platforms. In phase I, a prototype MEMS sensor will be fabricated and parameter sensing will be verified. This provides the groundwork for the development of a deployable, near-final-scale prototype module in Phase II.