Nanodielectrics for High Energy Density Capacitors

Agiltron, in collaboration with the Nanodielectric Group headed by Prof. Lei Zhu and Steven Boggs at the University of Connecticut (UConn), proposes a novel nano-engineering approach to develop a new category of nano-dielectrics for high energy density capacitor applications. The new approach combines the cutting-edge nanomaterials development and manufacture at Agiltron and extensive experience in materials design and simulation within the UConn team. The proposed nanodielectrics integrate high dielectric constant ceramic nanoparticles, an interphase nano-layer, and a polymer matrix with high breakdown strength. Our nanocomposites are expected to have a dielectric constant of 2 to 3 orders of magnitude larger than that of the matrix polymer, breakdown strength of ~300 V/ìm, dielectric loss less than 0.01, and calculated energy storage density of over 30 J/cc. These nanodielectric films will be flexible due to the low filler loading, and they can be folded and rolled to build compact capacitors. These features are unattainable from the existing materials.  This Phase I will demonstrate the feasibility of the proposed approach. BENEFIT: The use of this technology would find application in most electronic devices. DoD, DHS, and other government organizations would benefit greatly from the reduction of size and weight, and the enhanced performance of capacitors. Civilian applications include capacitors and other passive devices in all electronic devices, and electronic packaging.