Monolithic SiGe SWIR Imaging Cameras

Agiltron, in collaboration with RTI International and Black Forest Engineering, will demonstrate in this program a low-SWAP (size, weight, and power), large pixel resolution, sub-10 µm pixel pitch SWIR imaging camera that will meet the Army’s requirements for imaging performance. The heart of the imaging camera is an integrated SWIR CMOS imaging FPA that combines a Ge/Si-based photodiode array with a CMOS ROIC array. In Phase I, we have demonstrated cutoff wavelengths of greater than 2.0 µm in Ge/Si photodiode structures, and in Phase II we will leverage these results and Agiltron’s proficiency in optoelectronic module design, assembly, and manufacturing to fabricate a 640×512 SWIR imaging camera.