Enabling Commercialization of a Lead-Free Coating Manufacturing Process

This Phase I SBIR program addresses the need for a manufacturing process that enables high reliability Pb-free tin coatings. Pb-free tin solders used in electronics applications have demonstrated whisker growth, due in part to compressive stresses within the deposit, causing failures of the components. Faraday Technology, Inc., proposes an enhanced Faradayic deposition process for Pb-free tin solders that have controlled internal stresses that minimizes or eliminates whisker growth, and enables commercialization of Pb-free tin solder, for high reliability, environmentally benign electronics manufacturing. During the Phase I program, Faraday will work with researchers at the National Institute of Standards and Technology to provide the foundation for further process development by demonstrating control of internal stresses in a Pb-free tin deposit through application of the Faradayic process. The Phase I effort will evaluate the effect of varying process parameters on the ability to generate compressive, zero, or tensile stresses within the deposit. In the Phase II program, Faraday will develop a library of Faradayic process parameters to achieve the internal stress configuration desired by industry, perform long-term environmental testing, and scale-up the process. Anticipated Results: The successful completion of our proposed project (Phase I and II) will result in an enabling process technology for Pb-free tin coatings. The project will have a significant environmental impact through the commercialization of Pb-free tin deposits for critical electronics applications, such as those used in the aerospace industry. The industry addressed, electronics manufacturing, is an important aspect of the U.S. commercial economy and will play an increasing role in the United States as well as the world.