Development of Cad Plating Replacement with Alkaline Zinc-Nickel Electroplating for Threaded Fasteners/Components

This proposal outlines a brush plating-specific advanced technology development program that would complement a recently awarded SERDP-funded Cd Replacement effort to be undertaken by Integran Technologies Inc., a company affiliated with the present applicants. The objective of the SERDP program is to develop a nanocrystalline Zn-based Cd replacement plating process that relies upon low hydrogen evolution and optimization of the pulse plating parameters in order to eliminate issues associated with embrittlement of high strength steel substrates, consistent with the objectives of this Air Force program. The goal of the present SBIR project proposed herein would be to complement the more fundamental on-going chemistry and plating process developments of the SERDP program with a project focused specifically upon brush plating issues in particular. As an example, one primary technical thrust of the SERDP effort will be the exploration of the pulse waveform shape optimization for complete elimination of hydrogen i.e. the utilization of pulse-reverse plating in order to “lift” hydrogen off from the fastener/component surface. Unfortunately, pulse-reverse plating may be incompatible with the non-consumable anodes commonly utilized in brush plating, thereby necessitating the development of a novel Zn-based plating technique that is embrittlement-free yet compatible with existing cadmium brush plating infrastructure.