Distributed Sensor System Innovations

The objectives for this Phase II effort follow logically from the Phase I proposal and the ground work laid in Phase I. The overarching goal is to prove a radically different approach to sensor packaging which offers a quantum leap in cost reduction and manufacturability improvement. Preliminary testing results from Phase I indicate that the alternative technical approach to telemetry packaging and construction is feasible. In Phase II we propose to substantiate this concept through more extensive test and evaluation. 3Pi proposes that a substantial number of complete composite canister assemblies, including an all-up operational Vector Sensor Node (VSN) telemetry module with appropriate header/cable subassemblies be constructed and subjected to the full series of tests imposed upon current distributed sensor systems, to ensure that the proposed technical approach meets all stated operational requirements and results in a sufficiently rugged packaging solution that can be deployed in the field. 3Pi proposes to further this research by designing a new 8-channel VSN disk sensor array package and proving the concept in test in the Option tasking.