Compact Condensers for Electronics Cooling

To enable the integration of high power electronics into future military platforms, an efficient compact condenser technology which is compact, lightweight, and efficient is needed to remove waste heat from these electronics. Aspen Systems endeavors to meet this need by proposing an advanced condenser design concept which promises to enhance heat transfer on the mini-, micro-, and nano-scales to achieve heat transfer coefficients in excess of 50,000 W/m2-K while minimizing pressure drop. Furthermore, this innovative design concept is compact, low-profile, lightweight, high-strength, and scalable across a wide range of capacities. These benefits are largely derived from its basic flat plate configuration which is manufactured and assembled using modern, reliable techniques. The low-profile, block-like form, and flat footprint allow ease of installation and integration into or on top of electronics enclosures. Aspen Systems is a leader in developing microclimate conditioning systems based upon vapor-compression technology. Aspen develops refrigeration components and integrated packaged systems for electronics cooling and has particular core competencies in micro-channel heat exchangers for both evaporators and condensers. Aspen is well-positioned to support long-term development efforts and commercialization for micro-channel heat exchangers and refrigeration systems.