Ruggedized RF Photonic Networks Using Flip-Chip VCSEL Transceivers

We will integrate RF circuitry within VCSEL-based transceivers designed to couple light into multi-mode fiber and/or printed circuit board waveguides. VCSELs offer SWAP and cost advantages over traditional modulator/edge-emitter devices by reducing power consumption, allowing for dense integration into chip-scale packages, lower cost devices and relaxed packaging tolerances. We will leverage the existing flip-chip packaging technology developed for a mil-grade 10 Gbps transceiver by replacing the digital circuitry with RF circuitry. The packaging technology includes lenses that couples all VCSEL to minimize modal noise effects, low parasitic flip-chip electrical bonds to reduce EMI, current-source VCSEL drivers for better RF linearity and potential for integrating up to 12 channels into a single package. The Phase I program will have key tasks: 1) definition of system requirements, 2) definition/prioritization of interconnect architecture in a trade-off study, 3) RF characterization of existing components, and 4) preliminary design of key circuit blocks.