Development of Dielectric Films for Wound Capacitors

We propose to develop advanced capacitor films with low-cost by modifying the current commercial capacitor films. The dielectric constant, energy density, and temperature stability of commercial capacitor films can be significantly improved by depositing a high-dielectric constant organic or inorganic dielectric coating using plasma enhanced chemical vapor deposition (PECVD) process. With proper composition design and careful tuning of the interface, the dielectric blocking layer can also minimize charge injection and leakage current so the capacitor charge-discharge efficiency can be improved too. The innovative capacitor film will have energy density higher than 10 J/cc, dielectric loss less than 1%, delivery rates faster than milliseconds, improved thermal performance above 120 „aC, and graceful failure feature. Furthermore, since no expensive capacitor film processing facility (> $25M USD) required, the high energy density capacitor film can be scaled up and produced with the well-developed roll-to-roll PECVD technology with low capital investment (< $2MUSD).