Low-Cost Hybrid Tap-Echo Technique for Kissing Bond Inspection

Kissing bonds are those bonds maintaining intimate contact but carries no load. The kissing bond is undetectable with conventional nondestructive evaluation techniques because intimate contact allows sound and heat to transfer normally. In this proposal, Intelligent Automation Inc. (IAI) proposes to develop an innovative low-cost technique to inspect kissing bonds. This technique utilizes the shock waves to detect the strength of a bonded joint for a variety of repair materials and substrates in a rapid and reliable fashion. This system will be suitable for field testing of bond strength of varying materials and thickness by offering significant improvements in bond repair inspections through sophisticated image processing and analysis capabilities.