Advanced Phased-Array Module Interconnect Technology

The design and development of phased-array radars requires the integration of solid-state components and adequate thermal mitigation within the array lattice constraints. The current trend is towards increasingly planar designs and a reduction in the array depth. The MDA SPEAR program is one example in which a planar T/R “tile” architecture is utilized. System-on-a-chip technologies such as SiGe will help miniaturize the modules, but is only part of the solution. Advanced multi-layer board technology is needed in order to integrate the active devices, provide the required RF manifold, DC power and digital control to the array, while providing adequate thermal conduction. In Phase I, Applied Radar will investigate novel board technologies such as HTCC and LTCC which enable next-generation phased-array architectures and reduce cost. In Phase II, a prototype module will be developed utilizing the developed board technology which integrates active array components into a demonstration array. The target frequency range is X-band, but the developed technology could be utilized for other frequency ranges.