Large Format Uncooled Focal Plane Array

Uncooled focal plane array (FPA) technology has evolved such that high performance is achieved in the long wavelength infrared (LWIR) with small pixel pitch and fast time constant. Small pitch allows high resolution with reduction in optics size and weight. Black Forest Engineering (BFE) has demonstrated 1024x768 a-Si:H FPAs with 20 um pixel pitch, noise equivalent temperature difference (NETD) < 35 mK and time constant < 8 msec. On Phase I, BFE will demonstrate by design and analysis pixel circuit modifications to provide adjustable control of time constant and responsivity in a 17 um pixel pitch. On Phase II, this new pixel circuitry will be demonstrated in a 320x240 or larger format FPA, that achieves NETD < 20 mK at F/1.4 (LWIR @ 300 K). The new pixel circuitry will allow 1280x960 uncooled FPAs with high performance and hot source mitigation.