Ambient Temperature, Solvent-Free Plating of Dense Aluminum Coatings
Award amount
$149,999Program and phase
SBIR · Phase IAward year
2007Award details
- Awarding agency
- Department of Defense
- Branch
- Navy
- Recipient company
- ELTRON RESEARCH & DEVELOPMENT, INCORPORATED
- Proposal award date
- 2007-09-06
- Contract end date
- 2009-02-11
- UEI
- HJ7KXNJ9CV48
- Solicitation number
- 2007.2
- Topic code
- N07-115
Research abstract
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- Refractory Coating for Heat Resistant Portable Helipad
- Advanced Nanostructured Powders for Cold Spray Applications
- Highly Durable Catalysts for Ignition of Advanced Monopropellants
- A Reactive Coating for Air Purification
- Novel High-Temperature Pressure Sensors for Extreme Service Applications
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- Non-toxic process for depositing high density, corrosion-resistant aluminum alloys on complex geometry components
- Non-toxic process for depositing highly-dense, corrosion-resistant aluminum on complex geometry components
- Non-toxic process for depositing high density, corrosion-resistant aluminum alloys on complex geometry components
- Electroless Plating of Corrosion-Resistant Aluminum Coatings for Steel
Research funding history
318 SBIR/STTR records share this UEI (1983–2013). Reported award amounts total $59,197,041. Reported amounts are not federal obligations.
Phases: Phase I, Phase II
Agencies: Department of Energy, Department of Defense, National Aeronautics and Space Administration, National Science Foundation, Environmental Protection Agency, Department of Agriculture