SBIR/STTR Research Award
Nanocomposites for Electrically Conductive Structural Adhesives and Bolt Hole Fillers
Award amount
$99,942Program and phase
SBIR · Phase IAward year
2007Award details
- Awarding agency
- Department of Defense
- Branch
- Air Force
- Recipient company
- MATERIALS RESEARCH INSTITUTE, LLC
- Proposal award date
- 2007-04-30
- Contract end date
- 2008-08-30
- UEI
- Not reported
- Solicitation number
- 2007.1
- Topic code
- AF071-121
Research abstract
This Phase I program will use metallized carbon nanofibers to develop a class of electrically conductive structural adhesives and bolt hole fillers to improve the electrical and thermal transport properties of organic matrix composite structures. Metallized carbon nanofibers have the beneficial large aspect ratio of the carbon nanofiber and high electrical conductivity of the metal. They can confer significant electrical conductivity to polymer resins at moderate concentrations. In Phase I, MRI will produce silver- and copper-metallized carbon nanofibers of varying metal compositions. The metallized carbon nanofibers will be integrated with structural adhesive resins to formulate the electrically conductive structural adhesives and bolt hole fillers. An initial screening test will be employed to identify the most promising candidate materials. More elaborate electrical, thermal, mechanical, and lightning strike characterizations will be carried out on samples of selected candidate materials to demonstrate the feasibility of the proposed technology.
Technology keywords
Not reported
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- Nanocomposite for Electrically Conductive Structural Adhesives and Bolt Hole Fillers
- Nanocomposite for Electrically Conductive Structural Adhesives and Bolt Hole Fillers