Low Profile Multi-Mode Tamper Detection Sensors

A multi-layered approach to tamper detection is emerging that consists of two complementary sensor technologies: micro-electro-mechanical-system (MEMS) vibrational sensors to detect acoustic and grinding threats, and a nanoparticle-doped thin film sensor that is responsive to x-ray and focused ion beam (FIB) radiation. The sensors not only will detect an attack, but also characterize it, and a report or a penalty response may be invoked. The size of these cantilevers will allow multiple redundancies for multiple frequencies without impacting the host device. In Phase I it was clearly demonstrated that multiple micro-cantilever beam arrays can be designed that will cover multiple frequency bands. The thin film is covert, requires no maintenance, does not affect the performance of the device being protected, is projected to be inexpensive to fabricate and apply, and since the material chemistry is highly stable, it should have a long shelf life. Importantly, since these technologies do not affect the performance of the device, they are applicable to legacy as well as new systems. Phase II will continue the advanced development of these technologies, leading to a product that is producible and cost-effective for military or commercial uses.