Near Atmosphere Plasma Processing Application of Anti-Tamper Coatings

The Missile Defense Agency (MDA) has issued a directive to protect, by application of anti-tamper (AT) coatings, Critical Program Information (CPI) from unintentional transfer on MDA acquisition and associated technical programs. The mission is to deter the reverse engineering and exploitation of our military’s critical technology. Engineered Coatings Inc., with Southwest Research Institute, and Analytical Solutions, Inc., propose to demonstrate an innovative near-atmosphere plasma processing method to deposit AT coatings onto semiconductor substrates. This unique deposition method is essentially container-less and can be used for substrate etching, functionalization, and deposition of coatings at relatively low temperatures, which will not degrade the device. Plasma cleaning of bond pads is already an accepted processing method. Incorporation of embedded sensors in the AT coating, to detect tampering attempts, will be developed. Anti-tamper coatings will be applied to silicon substrates for subsequent adhesion tests and removal investigations using reverse engineering techniques, including ion-etching, chemical, and mechanical methods. Embedded sensor networks will also be tested during the removal attempts. Near the end of the program, a selected electronic device will be used for coating demonstration, followed by electrical performance testing.