Ballistic Missile Defense Anti-Tamper Coating Manufacturing

The implementation of anti-tamper (AT) technology as one vital strategy for preserving US military superiority. (Communiqué DoD 5200.1-M) In response to this need, many AT technologies have been developed including AT coatings for securing electronic components and devices. However, the use of successful AT coatings is impeded by lack of a manufacturing process that: 1.) Possesses the capacity for utilizing these technologies in a composite coating formulation; and 2.) Can be used to apply coatings to heat-sensitive electronics without adversely affecting their operation or shorten their useful life cycle. A technology and methodology is proposed for development and application of anti-tamper coating processes for substrates that differ greatly in shape, size, topography, and material type. This technological capability includes applying high temperature melting polymers and metals onto heat-sensitive electronic circuits. This technology can be used to create composite coatings of various layers and materials and can fully incorporate materials of various sizes and shapes into the coating. The Phase I research will demonstrate not only the feasibility of the technology, but will demonstrate the broad utility of the coating process. The coatings manufacturing technology, and demonstrated capabilities, will provide the missing manufacturing capability for forming advanced AT coatings.