High Performance Thermal Transfer Material

Basic Electronics, Inc. has developed and patented a unique, composite material that provides significant potential for solving thermal problems and weight problems associated with current systems used to dissipate heat. This composite material conducts heat at rates of up to five times greater than that of copper and is approximately half the weight of aluminum. The purpose of this proposal is to demonstrate the performance of the thermal composite material in various configurations to resolve thermal management and weight problems in electronic systems.