Nanostructured High Frequency 3-D Coaxial Interposer Array

This Navy Small Business Innovation Research Phase I project provides an 80% package size reduction, reliability improvement and dramatic cost reduction of semiconductor linear amplifier packages and assemblies, while providing signal integrity beyond 10 gigahertz. Our research and development project will demonstrate 3-D coaxial, low inductance, nanostructured integrated passive capacitor arrays to provide several performance solutions, functionality improvements, quality improvement (by eliminating fractures), and an 80% reduction in the size of semiconductor circuit blocks. Our research entails formulation and processing of nanostructured multilayer barium titanate dielectrics and design of innovative miniaturized, low inductance, coaxial integrated passive capacitor interposer arrays to provide decoupling, bypassing and reservoir energy storage, while eliminating the effects of electromagnetic interference (EMI) noise. This family of integrated interposer arrays is inserted underneath the semiconductor chip and provides coaxial output for each input/output (I/O) and thus eliminates the need to fan out circuit board traces for mounting individual bypass, decoupling and reservoir energy storage capacitors. This nanostructured capacitor array will operate from DC through 10 gigahertz. Our R & D project will result in immediate market applications in military, industrial and consumer products.