SBIR/STTR Research Award
Dielectric Materials Enhancement via Excimer Laser Processing
Award amount
$1,057,440Program and phase
SBIR · Phase IIAward year
2006Award details
- Awarding agency
- Department of Defense
- Branch
- Army
- Recipient company
- AMBP Technology Corporation
- Proposal award date
- 2006-09-11
- Contract end date
- 2008-09-11
- UEI
- Not reported
- Solicitation number
- 2005.2
- Topic code
- A05-019
Research abstract
AMBP Tech in collaboration with the ESI of SUNY UB has demonstrated the improvement of surface flashover on dielectrics by a factor of 2x utilizing laser processing techniques. Based on our extensive experimentation and characterization in Phase I we have developed a working hypothesis that unites the debating theories of surface flashover propagation and a path to increasing the surface flashover strength by at least an order of magnitude. In the Phase II program we will flesh out the details of our understanding of the interplay between the two competing propagation mechanisms of surface flashover and use this understanding to develop a reliable laser process to achieve significantly higher surface flashover strengths. Additionally, AMBP Tech, utilizing is strong vendor relationships and capital equipment assembly know how, will build a 6 axis motion control system to treat the surfaces of complex shaped dielectrics so that we can field test the laser treatment with DOD customers as well as commercial partners.
Technology keywords
Not reported
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