Processing Methods to Fabricate Reliable Device Elements of PMN-PT Piezoelectric Single Crystals

The Phase I program will concentrate on improving the reliability of flat wafers of melt-grown and solid state converted single crystal PMN-PT materials through surface quality management. Focusing on wafers rather than complex shaped parts maximizes flexibility for using materials of either the melt-grown or SSC type. It facilitates the development under Phase II of generic transducer materials configurations, such as multilayer stacks, that have widespread applicability in sonar, or allows single layer diced arrays for higher frequency applications. The main technical emphasis will be on novel grinding methods or combinations of rapid abrasive grinding combined with surface damage mitigation techniques.BENEFITS: The processes proposed by MSI will demonstrate cost-effective methods for controlling surface flaws that are applicable to both melt grown and SSC single crystal materials. This demonstration will facilitate the development of methods for improving the robustness of single crystal materials of both types against surface defects, and implement a manufacturing solution that can be transitioned to production. This solution will include methods for mitigating other reliability barriers, such as internal defects, to reach a comprehensive and cost-effective single crystal transducer materials reliability solution.