Shape Memory Alloy Destruction Mechanism (SMADM)

In the event of a physical compromise of a secure system, it may be necessary to physically disable the critical components of the system to ensure that critical hardware and software are rendered not useable for reverse engineering. Mide proposes to utilize the unique properties of shape memory alloys to fragment electrical components and boards in the event of a physical compromise. Shape memory alloys experience a transition from martensite to austenite when they are heated above their transition temperature. In martensite the material is very malleable, in austenite the material returns to its memorized shape and is capable of providing significant force. Mide proposes to memorize the shape memory alloy in a wave pattern and insert it into a PC board or electrical component. In the event of a breach, a large amount of current would surge through the electrical system destroying the software and causing the entire system to heat, which would in turn actuate the SMA to physically destroy the board.