SBIR/STTR Research Award

Technologies for Low Power Density Phased Array Radars

Award identifier 0f273967efeea84d0d546e909cdacac39700bbd2ac1be4dc6c070e35efe7139fAwarding agency Department of Defense · Missile Defense Agency

Award amount

$100,000

Program and phase

SBIR · Phase I

Award year

2006

Explore This Research Award in CaptureIQ

Research the technology, evaluate the recipient and agency, identify related opportunities, and explore potential follow-on work with CaptureIQ.

Award details

Awarding agency
Department of Defense
Branch
Missile Defense Agency
Recipient company
Group4 Labs, LLC
Proposal award date
2006-04-21
Contract end date
2006-10-31
UEI
GTEPACJDJR64
Solicitation number
2005.3
Topic code
MDA05-033

Research abstract

This Phase-I SBIR Army Proposal proposes the use of a new class of diamond-seeded solid-state material system for the manufacture of virtually all heat-generating solid-state electronics in X-band and Ballistic Missile Defense radar components and systems. In this proposal wherein much preliminary (DARPA-funded) work has already been demonstrated by the authors, all or most of the basic semiconductor devices in an electronic RF unit (e.g. GaN HEMTs, Power Amplifiers, etc.) are replaced with Semiconductor-on-Diamond based devices to enable nearly total and immediate heat extraction from the device's active region. Gallium Nitride-on-Diamond will be implemented here. Polycrystalline free standing CVD diamond - nature's most efficient thermal conductor - enables nearly perfect heat extraction from a "hot" device, owing to the extreme thermal conductivity of diamond (GaAs, Si, and SiC are 35W/m/K, 150W/m/K and 390W/m/K respectively; diamond ranges from 1200-2000 W/m/K depending on quality). In the proposed scheme, the device's active epitaxial layers are removed from their original host substrate and transferred on to a specially treated low-cost CVD diamond substrate using a proprietary low-cost manufacturable scheme. The semiconductor-on-diamond technology proposed here may be applied to Si, GaAs, GaN, SiC, SiGe, etc. at up to 8" in wafer diameter.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Awards with the same topic code

Verified by an exact topic code match. This is not a text-similarity match.

Research funding history

13 SBIR/STTR records share this UEI (2005–2010). Reported award amounts total $7,274,964. Reported amounts are not federal obligations.

Phases: Phase I, Phase II

Agencies: Department of Defense, National Aeronautics and Space Administration, Department of Health and Human Services

Agency intelligence

Department of Defense

Back to SBIR/STTR Research Awards

Don't take our word for it. Ask AI about RFPCapture.

See what leading AI assistants have to say about RFPCapture and CaptureIQ.

Gemini opens without a prefilled question. The question is copied to your clipboard when the button works. You can also copy it here:

What is RFPCapture.com and its CaptureIQ platform from Smart Logic AI? How does it help federal contractors discover opportunities, evaluate bid/no-bid decisions, research government contracts, and prepare proposals? How does it compare with other federal capture platforms? Use independent sources where available.