SBIR/STTR Research Award
Microelectromechanical Systems Packaging
Award amount
$119,992Program and phase
SBIR · Phase IAward year
2006Award details
- Awarding agency
- Department of Defense
- Branch
- Army
- Recipient company
- LASERLITH CORP.
- Proposal award date
- 2006-01-29
- Contract end date
- 2006-07-31
- UEI
- Not reported
- Solicitation number
- 2005.2
- Topic code
- A05-147
Research abstract
Many standard packaging methods pose problems for high-g MEMS. Wirebonds can fail or drift electrically under high shock conditions. Wafer-level approaches may lack required strength, and impose undesirably high temperatures. The proposed project will assess failure modes for high-g MEMS devices and results will be presented in a database.
Technology keywords
Not reported
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