SBIR/STTR Research Award
Modular Spray-Cooled Assemblies for High Heat Fluxes
Award amount
$599,981Program and phase
SBIR · Phase IIAward year
2006Award details
- Awarding agency
- National Aeronautics and Space Administration
- Branch
- Not reported
- Recipient company
- Power Electronics Leveling Solutions LLC
- Proposal award date
- 2005-12-28
- Contract end date
- 2007-12-27
- UEI
- Not reported
- Solicitation number
- Not reported
- Topic code
- E1.07
Research abstract
This NASA SBIR Phase II project will produce a flight suitable test bench based on a modular spray-cooled assembly that considers NASA power and mass budgets and can be scaled to cool multiple heat sources producing high heat fluxes under gravity and microgravity conditions. Thermal management solutions for certain NASA applications like laser diodes are not all that suitable with a need for a better solution.
PELS in a NASA SBIR Phase I project developed a modular assembly based on spray cooling under phase change achieving heat fluxes approaching 100 W/cm2 per evaporator using FluorinertTM(FC-72) as the cooling liquid. This was possible because of PELS novel fluid removal approach.
This Phase II project builds upon the improvements in spray cooling performance by bringing improvements in the packaging to achieve volume and weight gains at the system level so spray cooling can become the standard thermal management solution.
The terminal objectives of this SBIR Phase II project are (a) To optimize the design of the modular spray-cooled assembly demonstrated in the SBIR Phase I project, and (b) To extend this design to cool multiple heat sources subjected to heat fluxes approaching 200 W/cm2 under microgravity conditions.
Technology keywords
Not reported
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- Advanced Heat Transfer Fluids
- Advanced Pumps and Cold Plates for Two-Phase Cooling Loops
- Advanced Heat Transfer Fluids
- Advanced Pumps and Cold Plates for Two-Phase Cooling Loops
- Ultra-Dense Multistage Thin Film Thermoelectric Cooler enabled by Massive Filo-Layer Technology (MFT)