Damping of Micro-scale Devices Using a Hybrid Magnetostrictive/Shape Memory Thin Film

Future combat systems will involve "smart" munitions with MEMS inertial measurement units (IMU) to control positioning and targeting. Precision targeting is problematic with these new IMU sensors because the vibration and shock during launch and flight can cause drift in the sensors. A passive vibration module is proposed to dampen these extraneous vibrations, such that precision targeting can be achieved. The dampen module utilizes a hybrid magnetostrictive/shape memory alloy thin film to passively dampen the mechanical vibrations. The module is compact and adds minimal mass and dimension to the packaged sensor. It is integrated at the die level and fabricated using MEMS compatible processes.