Non-Intrusive 3-D Image Inspection of Multi-layer Printed Circuit Boards and Electronic Devices

This proposal describes efforts planned for the design and development of a non-intrusive method for the inspection of electronic systems and components using X-ray digital laminography and tomosynthesis. This approach provides a non-destructive means for the inspection of a device under test while enabling high fault coverage of all pins, which is especially applicable to today's aging electronic systems. Due to the increasing complexity of current printed circuit boards, there is a need for a more sophisticated and efficient method for the inspection and analysis of these devices. Herein lies a growing demand for a more technologically innovative images analysis system to meet these challenging advancements. X-ray inspection systems provide a non-destructive means for detecting defects in tracks, solder joints, solder fill, solder fill integrity, component misalignment, component misplacement, opens and shorts. During Phase I we create a design for our proposed approach, addressing requirements associated with materials, components, interface requirements, limitations, and expected performance criteria. In addition, we develop a functional prototype of the system to demonstrate the viability of our approach for further development during Phase II.