Vacuum Packaging for Resonant Microsystems

Resonant MEMS sensors offer high sensitivity for military applications, and their development will address billion dollar markets for automotive, aerospace, robotics and condition-based maintenance applications. However, high-performance resonant MEMS require expensive vacuum packaging for high-Q and intimate electrical integration. Although MEMS and CMOS processes are incompatible. The proposed project addresses the largest cost components for resonant MEMS, often 95% of costs. MicroAssembly’s packaging capability has demonstrated high yields on wafer and die scales. This bonding process has been successfully used to seal MEMS in vacuum. Phase II work will focus on improving vacuum lifetimes and packaging a gyroscope provided by the military.