Passive Thermal Management System for High-Temperature Military Aircraft Actuation System

Development of high-temperature, high-efficiency, and high-density power electronic component technologies as part of the more electric aircraft (MEA) effort offers opportunities for passive, compact, and lightweight thermal management systems for aircraft actuation systems. The next-generation power electronics will operate at a cold plate temperature of 200 °C making it possible to reject its heat through the structure to the ambient environment without active cooling. The thermal load averages 3 W/cm2 with peaks up to 30 W/cm2. Technology Assessment and Transfer, in association with Technology Applications, Inc. proposes to evaluate an advanced primary heat sink of phase change material filled carbon foam and to assess several heat rejection approaches, including heat pipes. At the conclusion of this program, TA&T and TAI will be prepared to design, construct and test a bench scale prototype thermal management system.