High Reliability of Focal Plane Arrays by Microwave Hybridization Techniques.

MBI proposes to extend our earlier hybridization and rework success with quantum well-type infrared detectors to mercury cadmium telluride (MCT) type detectors. This goal of this project is to increase hybridization yield and lower overall costs of focal plane array (FPA) infrared detectors commonly found in missile interceptors and passive infrared sensor platforms. MBI technology used in the assembly and rework of the IR detectors does not subject the devices to high temperatures or high pressures during the attachment process; especially since the FPA and the readout electronics typically have different coefficients of thermal expansion. Technical objectives under this Phase I effort include (1) developing a low stress (applied pressure) process appropriate for MCT detectors, (2) characterizing and minimizing adverse microwave processing effects on detector array and readout electronics, and (3) obtaining thermal cycling reliability data for indium bump arrays that have been microwave processed.