Advanced Packaging Concept for High Temperature Silicon Carbide Power Modules (kTC P214)

k Technology Corporation (kTC) proposes to develop an Integrated Thermal Module (ITM) to be an integral part of a high performance power electronics package using silicon carbide (SIC) devices. The module will optimize the heat transfer from the active silicon carbide to the cooling fluid. By minimizing the temperature rise through the package, the coolant temperature can be maximized, and therefore the heat exchanger can be made smaller. The proposed package material has high conductivity, low coefficient of thermal expansion, and low mass density. The high conductivity and low CTE will minimize the thermal impedance through the power electronics package. To demonstrate the effectiveness of the Integrated Thermal Module under realistic loads it will be integrated into a converter. The converter will be tested with a permanent magnet motor and passive inductive loads.