INNOVATIVE, THERMALLY STABLE, POLYIMIDE ADHESIVE TECHNOLOGY

This Phase I SBIR program will develop a high temperature film adhesive with a service use temperature in excess of 316°C that exhibits improved handling characteristics, higher toughness, and lower melt viscosity than the current commercially available state-of-the-art polyimide film adhesive, FM 680-1. Under the proposed research effort Performance Polymer Solutions Inc. will employ an innovative, novel approach to optimize the critical performance characteristics of an adhesive formulated resin system. In the Phase I effort, P2SI will incorporate an innovative inorganic reactive plasticizer to lower the melt viscosity, increase ductility and adhesion, and tailor the film to exhibit more epoxy-like handling characteristics, with volatile levels less than 5%. Ductility and performance will also be improved through incorporation of surface- functionalized fillers. In the Phase I Option, P2SI will utilize the Phase I technology to respond to engine manufacturer requests for a 600°F cure temperature. These systems have enormous pay-off potential for both military and commercial applications.