A Decomposition Based Approach to Optimal Layout of Complex Systems such as UAV's and Satellites

This STTR proposes to solve the problem of automated component placement (also known as intelligent packaging) for UAV's and other products by building on our unique state-of-the-art, patented technology platform. The goal of this work is to enable the automated layout of an entire complex product, such as a UAV, featuring a multitude of systems and subsystems with 3D components. This will be accomplished by developing a method for computationally decomposing a system into subsystems, solving the subsystem layout problem in sub-defined spaces with our "Extended Pattern Search" (EPS) technology, and re-integrating the subsystems together. In developing the necessary methods this project will create a tool for use on UAV's, satellites, missiles, and other military and non-military products such as printed circuit boards (PCB) and automobiles. This technology is critical for the successful evolution of UAV's for two reasons: first, time to market affects both cost and deployment of new UAV's to meet Air Force needs, and second, faster design time allows for more extensive analysis and verification of performance and quality, improving the effectiveness of the UAV program.