High Rate and Effective Thermal Energy Storage System Using Phase Change Material for Transient High Power Thermal Management

The team of k Technology Corporation and the University of Dayton Research Institute propose to develop an integrated packaging concept for high power density devices that combines two innovative technologies: encapsulated annealed pyrolytic (referred to as k-Core); and phase change materials (PCM). The metal encapsulation material surrounding the APG will have a coefficient of thermal expansion (CTE) designed to match the mounted devices(s). k-Core is a composite material with five times the conductivity of aluminum and will be used as an efficient heat spreader lowering the high flux density to a manageable level while distributing this energy into the PCM. The internal geometry will be configured to minimize the conduction paths through the PCM limiting the negative effects of the low conductance of the PCM. If deemed necessary, a metal or graphite foam will be used to further improve the conductance path into the PCM.