Microwave-assisted Packaging Platform for RF MEMS Switches

The objective of this 24-month, Phase II effort is to develop a low cost, wafer scale (4 inch diameter and larger) process to hermetically seal RF switches at Level Zero and Level One packages. MBI is looking to focus on packaging of switches supplied by CMSS, the RF Microsystems Group at Sandia National Laboratories, and patented RF MEMS switches designed and developed at the Aerospace Corporation. The advantages of this packaging platform and the associated integration tool developed under this project are: (1) Hermetic sealing using thin film metal bond lines. (2) Low insertion loss. Preliminary EM simulations suggest areas for design improvement of cap dies. (3) Localized heating. This allows metallic sealing on temperature sensitive substrates. (4) Wafer scale packaging. Technical milestones include (1) demonstrating leak rate results below 1 torr per year, (2) demonstrating less than 0.05dB insertion loss decrease increase due to packaging, and (3) sealing at the 4 inch wafer level. Deliverables will be test data and packaged switch samples to support space qualification requirements (as per Mil-Std 454 and Mil-E-8983).