A novel micro-channel heat exchanger for high heat flux electronics

In this Phase I STTR program, Advanced Ceramics Research Inc. (ACR) and its university partner successfully developed and optimized a novel, low-cost, micro/milli-channel heat exchanger system for high power electronic applications for the Navy and other DoD applications. ACR used the extrusion freeform fabrication process to create the novel heat exchange structures. The samples were tested in single-phase and two-phase (boiling) flow to assess the overall heat transfer coefficient of different geometries. A close-form analytical solution was developed to optimize the channel dimensions. The ACR led team proved the concept and fabricated prototype heat exchanger components, developed guidelines for optimizing the performance. In the phase II program, optimized components will be fabricated and scaled up. Other organizations will provide design criteria, thermal modeling for prospective packages, and finally a test for comparison to a conventional package. All the phase I technical objectives were met successfully. ACR has discussed the phase I results with DoD prime contractors as well as commercial entities. The promising results in the phase I program and the partnering with commercial partners who bring complementary strengths to the team for the phase II program suggests that a commercially successful product could be brought to the market.