Autonomous Cooling Module for Advanced Electronic Systems

MicroEnergy Technologies is developing an autonomous cooling module, capable of removing waste heat fluxes of up to 1000 W/cm^2 from electronics and other devices. The cooling module will utilize an extremely efficient microchannel heatsink geometry and two-phase (boiling) flow to maximize heat transfer rates. The heat transfer will be further enhanced through the use of nanofluids with uniquely beneficial thermophysical properties. The module will utilize a number of technological innovations to create a self-pumped device that requires no electrical power input. The combination of these technologies will result in a compact, robust, high-performance cooling module that can be adapted to a wide range of thermal management problems. Phase II will build on the foundations of technological feasibility laid during Phase I, with the ultimate goal of creating a working prototype of an autonomous cooling module. This development work will lead us to a series of design guidelines that will be used to create one or more commercializable products during Phase III of the project.