Batch Capable Polylithic Integration: Titanium Micromirror Array

MicroAssembly Technologies, in collaboration with UC Santa Barbara, is submitting this SBIR Phase II proposal to DARPA's Microsystems Technology Office. The team brings together experts in the fields of 3D microfabrication, metal-based MEMS, and heterogeneous technology integration. The proposed effort will continue the development of UCSB's titanium MEMS technology, as well as MicroAssembly's MEMS-IC integration and batch assembly capabilities. The program will aim to deliver a high-density, digital mirror array, enabled by newly developed metal MEMS and thin-layer bonding methods. The proposal builds upon MicroAssembly's Phase I results in the area of back-end integration, whereby existing technologies (such as MEMS and foundry ICs) may be fused, without the sacrifice of economy or performance seen in monolithic approaches.