High Thermal Conductivity Functionally Graded Heat Sinks for High Power Packaging

This NASA SBIR Phase I program proposes the development of a high thermal conductivity (400 W/mK), low coefficient of thermal expansion (7-10 ppm/?K), and light weight (3-4 g/cm3) functionally graded material (FGM) heat sinks for microelectronic packaging applications. The uniquely defined ?FGM concept? pursued in this project uses a metallic package base that consists of a light metal matrix composite material to provide low thermal expansion and a high thermal conductivity functional core to cool the high power semiconductor die. The thermal performance of the heat sink is doubled by using the high thermal conductivity functional core bonded through the body of the heat sink.