SBIR/STTR Research Award

Reflective Arrayed Waveguide Gratings for Dense Communication, Sensing, and Signal Processing Systems

Award identifier a9b49b40497cf849cb38b5cc59e45dd7098dba9fa6a962245e31eb0a44976edfAwarding agency Department of Defense · Missile Defense Agency

Award amount

$70,000

Program and phase

SBIR · Phase I

Award year

2004

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Award details

Awarding agency
Department of Defense
Branch
Missile Defense Agency
Recipient company
INTELLIGENT FIBER OPTIC SYSTEMS CORP
Proposal award date
2003-07-23
Contract end date
2004-01-22
UEI
HCXHVBD9HKN9
Solicitation number
2003.1
Topic code
MDA03-053

Research abstract

IFOS proposes to design and simulate photonic integrated circuits for dense communication, sensing, and signal processing systems. Photonic Integrated Circuits (PICs) are key elements of modern optical communication, sensing and signal processing. Arrayed Waveguide Gratings (AWGs) are state-of-the-art optical devices that are built on a PIC chip. They are used for multiplexing and demultiplexing, and as a building block for more complicated devices such as, variable optical attenuator, thermo-optic switch, optical channel monitor, etc. AWGs can also be optimized for specific systems such as multi-channel optical sensors and signal processors, making them ideal for multiplexed long-range sensing networks that require high volumes of data traffic. Such networks can be highly useful in applications such as missile tracking and detection systems. IFOS proposes a novel silica-on-silicon design of Reflective AWGs (RAWGs) that is suitable for fabrication on commercial fab facilities. In addition, a conventional Transmissive AWG (TAWG) is designed and simulated. The RAWG proposed here offers attractive benefit by reducing chip size to almost half of that of a TAWG and exhibits improved device performance. The developments anticipated in this proposal will result in a smart design of optimized photonic integrated circuit structures that can be fabricated with the help of a commercial fab facility. Two different class of structures will be investigated: a conventional, two-slab, transmissive AWG (TAWG) and a novel reflective AWG (RAWG). The RAWG structure proposed here will reduce the chip size by almost 50% and thereby significantly increase the yield of device per wafer. The proposed RAWG structure is unique and will allow more reliable packaging arrangement with improved product specification. The unique design and technological advantage offered by this product is expected to gain significant market potential in the optical communication industry, as well as for defense and space based applications.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Research funding history

172 SBIR/STTR records share this UEI (1994–2025). Reported award amounts total $61,008,158. Reported amounts are not federal obligations.

Phases: Phase I, Phase II, Phase II – Direct to Phase II

Agencies: Department of Defense, National Aeronautics and Space Administration, Department of Energy, Department of Health and Human Services, National Science Foundation, Department of Agriculture

Agency intelligence

Department of Defense

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