Bandgap Engineered Rad-Hard Multi-Function Digital MMW/Photonic Circuits

TLC has developed an innovative multi-component radiation hard InP HEMT based chip approach that will provide monolithic digital,millimter-wave and photnic functions for airborne, spaceborne and other military systems. During phase I we demonstrated lattice engineering, epi growth, design and device fabriction capabilities that resulted in high performance electronic and photonic devices using InP based HEMT structures. The electronic and photonic devices were engineered for various frequencies and wavelengths respectively. A transition layer was also demonstrated that will allow multi-devices to be developed and demonstrated on the same epi wafer. Therefore in Phase II, TLC will develop the multi-functio digital/photonic/ MMW circuits simulation, designs, fabrication testing and delivery.