SBIR/STTR Research Award

"Metal Rubber" Nanostructured Materials

Award identifier 11a1e9eb851deac5334ba57363a140ba22736ba6d989a11e6e62920a4a6c0bd7Awarding agency Department of Energy

Award amount

$99,999

Program and phase

SBIR · Phase I

Award year

2004

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Award details

Awarding agency
Department of Energy
Branch
Not reported
Recipient company
NANOSONIC INC.
Proposal award date
Not reported
Contract end date
Not reported
UEI
ZK7ECNMN7MM5
Solicitation number
DOE/SC-0075
Topic code
33

Research abstract

75245-A material that possessed the combined properties of ultralow mechanical modulus (rubber) and very high electrical and thermal conductivities (metal) would have numerous commercial applications. For example, such elastic conducting ¿metal rubber¿ materials would allow the manufacturing of mechanically flexible electrodes, improved flex circuits, fabric electronic networks and interconnects, as well as low weight thermally conductive packaging materials. This project will develop polymer/metal nanocomposites with these combined properties. These ¿metal rubber¿ materials would be formed by modifying the conventional electrostatic self-assembly (ESA) process. During Phase I, the cooperation of a major U.S. chemical processing company will be obtained to transition ESA methods from the laboratory to product manufacturing. Free-standing, self-assembled materials with the combined low modulus and high conductivity properties will be designed, synthesized, and evaluated. Investigations will be conducted to determine how these materials can best be transitioned to large-scale fabrication at established production facilities for specific near-term product markets. Commercial Applications and Other Benefits as described by the awardee: ¿Metal rubber¿ materials should have commercial applications as mechanically robust electronic and thermal interconnects in such electronic systems as sensors, actuators, electronic chassis, flexible electronics, and radio frequency identification (RFID) tags. Other uses include biomedical implants, electrodes on artificial muscles that require large strain ranges, replacing toxic lead-based solder for electronic connections on circuit boards, and as thermal control packaging materials where weight reduction is an issue.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Research funding history

469 SBIR/STTR records share this UEI (1998–2026). Reported award amounts total $155,330,549. Reported amounts are not federal obligations.

Phases: Phase I, Phase II, Phase II – Direct to Phase II

Agencies: Department of Defense, National Aeronautics and Space Administration, Department of Energy, National Science Foundation, Department of Transportation, Environmental Protection Agency

Agency intelligence

Department of Energy

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