Rapid Automated Parallel Placement and Integration of Thin Film Semiconductor Epitaxial Liftoff Devices onto Host Substrates

The objective of this effort is to develop processes, materials, and equipment which will allow automated, high speed placement of thin film semiconductor devices onto host substrates. Such host substrates will consist of integrated circuits, multichip modules, and others. Recent technological achievements have made possible the seperation of active semiconductor thin films from their substartes. This process known as Epitaxial Liftoff (ELO) provides for the integration of active semiconductor films with other materials or with other semiconductor drivers. A process ecently developed allows for the automated transfer of these semiconductor films to any host substrate using readily available materials and equipment from the semiconductor packaging industry. This process transfers the ELO film onto a carrier and then places and bonds the films onto the host substrate. This method will allow for the automated, highly precise placement of up to hundreds of thousands of semiconductor devices onto a host substrate in parrellel. The benefits of this proposal include the design, production and distribution of high speed, automated equipment for the selective bonding of Epitaxial Liftoff circuits onto host substrates. Applications for products resulting from such research include both high specification and commercial products.