SBIR Phase I: New Class of Ultra Low Dielectric Constant Polymers for Electronic Applications

This Small Business Innovation Research (SBIR) Phase I project proposes to develop a new class of advanced polymeric dielectrics based on polyphenylene Self-Reinforced Polymers (SRPs). Polymers with superior electrical, thermal and mechanical performance are critical for a variety of advanced electronics packaging and on-the-chip applications. A number of polymers have been proposed as an answer to this problem. All current organic dielectrics, however, have a fatal flaw: they all feature polar moieties that promote high dielectric constants and high moisture uptake. To overcome this problem this project will develop a new type of processable, high temperature, very low dielectric, very low moisture absorbing and low cost dielectrics containing no polar groups for usage in a wide variety of electronic packaging and interlayer dielectric applications. The commercial application of this project is in the broad area of electronic and on-the-chip type products. The absence of low dielectric constant polymers is limiting the development of the next generation of electronic devices. As architectures continue to decrease in size, demands for insulative properties cannot be met by existing materials and consequently emergence of the proposed material will have a significant impact on the industry.